Method and wafer for maintaining ultra clean bonding pads on a wafer
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United States of America Patent
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Jun 24, 2003
Grant Date -
N/A
app pub date -
Jul 12, 2002
filing date -
Jul 12, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention teaches a sawn wafer with ultra clean bonding pads on die which enhance the strength of wire bond and results in higher yield and improved reliability of packaged semiconductor die. Clean wafers ready for dicing are coated with a removable insulating water soluble non-ionic film which enhances clean saw cuts and reduces buildup. The protective film is hardened by heat and resists removal by cooling water used in dicing saws. However, after dicing the protective film is removable in a wafer washer using high pressure warm D.I. water. After removal of the protective film the electrode pads are virtually as clean as before dicing. The film may be used as a protective layer until the sawn wafer is ready for use.
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