Method of making a pillar in a laminated structure for a semiconductor chip assembly
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United States of America Patent
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Jun 24, 2003
Issued Date -
N/A
app pub date -
May 28, 2002
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a semiconductor chip assembly includes providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a conductive trace, an insulative base and a metal base, the conductive trace includes a routing line and a pillar, the metal base and the routing line are disposed on opposite sides of the insulative base, and the pillar contacts the routing line and extends through the insulative base and into the metal base, removing a portion of the metal base that contacts the pillar, and forming a connection joint that contacts and electrically connects the conductive trace and the pad.
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