Semiconductor package with stacked substrates and multiple semiconductor dice

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6583503
APP PUB NO 20020125558A1
SERIAL NO

10137584

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19209

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, ID 792 26906
Brooks, Jerry M Caldwell, ID 183 5602

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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MICRON TECHNOLOGY, INC. (8)
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GLOBALFOUNDRIES INC. (1)
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SILICON VALLEY BANK (1)
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HUGHES AIRCRAFT COMPANY (2)
5481134 Stacked high density interconnected integrated circuit system 23 1994
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NEC CORPORATION (1)
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* Cited By Examiner

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Patent Info (Count) # Cites Year
 
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* Cited By Examiner