Electromagnetic interference and heatsinking
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United States of America Patent
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Jun 24, 2003
Issued Date -
N/A
app pub date -
Apr 16, 2002
filing date -
Feb 26, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A first apparatus includes a semiconductor device and a heat dissipating device (e.g., a heatsink) thermally coupled to the semiconductor device. The heat dissipating device is located and formed to screen the semiconductor device from external electromagnetic radiation or to contain radiation produced by the semiconductor device. A second apparatus includes a semiconductor device, a heat dissipating device thermally coupled to the semiconductor device, and a grounding structure having a capacitive coupling to the heatsink.
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