Leadless plastic chip carrier with partial etch die attach pad
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United States of America Patent
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Jul 1, 2003
Issued Date -
N/A
app pub date -
Apr 3, 2002
filing date -
Jun 10, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A leadless plastic chip carrier comprising a die attach pad, a semiconductor die mounted to a portion of the die attach pad and at least one row of contact pads circumscribing the die attach pad. The row of contact pads have a thickness greater than the thickness of the portion of the die attach pad. A plurality of wire bonds connect the die attach pad and the contact pads. An overmold covers the semiconductor die and all except one surface of the at least one row of contact pads and the die attach pad.
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