Chemical-mechanical-polishing station
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 1, 2003
Grant Date -
Mar 6, 2003
app pub date -
Aug 31, 2001
filing date -
Aug 31, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A small footprint, integrated and automated semiconductor wafer processing system for planarizing semiconductor wafers. That processing system includes a wafer load station, at least one CMP polishing system, and at least one cleaning system. Also included is at least one wafer unload station and a robotic system. The robotic system, which includes from two to six robotic movers, moves semiconductor wafers through the semiconductor wafer processing system. The semiconductor wafer processing system can also include a buffer system for temporarily holding semiconductor wafers. The buffer system, the robotic system, the cleaning system, the wafer load station, and/or the wafer unload station in some applications are capable of Z-axis motion. CMP polishing systems and cleaning systems can be vertically or linearly stacked.
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