Importance

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Abstract

Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, a plastic sheet having an first surface is provided. An array of package sites is formed on the first surface of the plastic sheet. The package sites each include a metal die pad and leads surrounding the die pad. The package sites may be formed by applying a first metal layer on the first surface of the plastic sheet, and then applying a second metal layer in a pattern that defines the die pads and leads of the package sites. The first metal layer is then selectively etched using the second metal layer as an etch mask. Next, an integrated circuit die is placed on each die pad of the array. The die is electrically connected to the leads surrounding the respective die pad. An encapsulant is applied onto the first surface of the plastic sheets so as to cover the package sites. The plastic layer is removed by peeling, by dissolving the plastic sheet, or dissolving an adhesive connection between the plastic sheet and the encapsulated array. The packages are then singulated from the array.

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First Claim