Bump electrode and printed circuit board
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United States of America Patent
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Jul 1, 2003
Issued Date -
N/A
app pub date -
Mar 16, 1999
filing date -
Feb 21, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A bump electrode is a bump made from a fused metal in a shape of one of a circular cylinder, a cone, a pyramid, a frustum of a cone, and a frustum of a pyramid, formed on a substrate. A printed circuit board has a substrate and a wiring pattern provided thereon. The wiring pattern is made from one of a paste and a fused metal and has a cross-section at right angles with respect to an extending direction of the wiring pattern with such an aspect ratio of a depth thereof to a width thereof that the depth thereof is greater than a depth with an aspect ratio of 1:5 and the width thereof is smaller than a width with an aspect ratio of 1:5.
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