Dual chip in package with a wire bonded die mounted to a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 1, 2003
Grant Date -
N/A
app pub date -
Apr 26, 2001
filing date -
Apr 26, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package comprises a top die and a bottom die. The top die has top and bottom surfaces while the bottom die has top and bottom surfaces. The bottom die is mounted on a substrate, which has a top surface, such that the bottom surface of the bottom die faces the top surface of the substrate. The bottom surface of the top die is separated from the top surface of the bottom die by an interposer, which creates a space between the exterior regions of the top surface of the bottom die and the bottom surface of the top die. Each of a plurality of wires, which are electrically connected to the bottom die, runs through this space (i.e. runs between the top surface of the bottom die and the bottom surface of the top die), thereby permitting (if desired) the top die to be at least as large as the bottom die.
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