Importance

Loading Importance Indicators...

Abstract

Integrated circuit packages that may be easily stacked one on top of the other are disclosed. The package includes a molded plastic body having metal-coated interconnection posts on both its upper and lower surfaces. An integrated circuit is mounted on the upper surface. Metal traces on the upper surface electrically connect each bonding pad on the integrated circuit to a one of a plurality of groups of four interconnection posts on the upper surface. Vias through the substrate electrically connect each group of four posts on the upper surface to an interconnection post on the lower surface of the package. Two or more packages can be stacked and electrically connected by wedging the lower posts of a top package between each group of four posts on the upper surface of a lower package. The lower posts of the lower package may be soldered to a conventional printed circuit board, or may be mounted on a mounting substrate that also has corresponding groups of four interconnection posts.

Loading the Abstract Image...

First Claim