Vacuum package fabrication of integrated circuit components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 1, 2003
Grant Date -
Jan 3, 2002
app pub date -
Aug 10, 2001
filing date -
Feb 2, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A vacuum package for integrated circuit devices includes a sealing ring having multiple control spacers of uniform thickness distributed around the sealing ring. The sealing ring is in a designated area on a substrate, material and surrounds one or more integrated circuit devices. The vacuum package also includes a sealing layer on the sealing ring. A vacuum package lid is sealed to the sealing ring by the sealing layer on the sealing ring. The vacuum package lid provides a vacuum cell for the one or more integrated circuit devices.
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