Methods and structures for electronic probing arrays
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United States of America Patent
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-
Jul 1, 2003
Grant Date -
Jan 3, 2002
app pub date -
Feb 27, 2001
filing date -
Mar 13, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe card for testing electronic elements includes a layer of dielectric material provided with a plurality of cavities supported on a substrate. A mass of fusible conductive material having a melting temperature below about 150.degree. C. is disposed in each of said cavities, the dielectric material electrically insulating the masses of fusible conductive material from one another. A probe tip of conductive material having a melting temperature greater than about 150.degree. C. is provided at one common end of each of the masses of fusible conductive material. The probe contacts are separated from an adjacent probe contact by at least one channel formed with the layer of dielectric material.
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