Semiconductor device image inspection with contrast enhancement
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United States of America Patent
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Jul 1, 2003
Issued Date -
N/A
app pub date -
Aug 8, 2001
filing date -
Mar 21, 1996
priority date (Note) -
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Abstract
Machine vision methods for inspection of semiconductor die lead frames include the steps of generating a first image of the lead frame, generating a second image of the lead frame and any defect thereon, and subtracting the second image from the first image. The methods are characterized in that the second image is generated such that subtraction of it from the first image emphasizes the defect with respect to the lead frame.
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