Intelligent binning for electrically repairable semiconductor chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 1, 2003
Grant Date -
Jan 2, 2003
app pub date -
Aug 28, 2002
filing date -
Aug 2, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures is determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully