Chip socket assembly and chip file assembly for semiconductor chips

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6589059
SERIAL NO

09957822

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A chip socket assembly provides for the mechanical and electrical coupling of edge-mountable chips to a bus of a circuit board with relative ease. An edge-mountable chip may be placed in a slot defined by a base. A clip may be attached to the base to retain the chip in the base. Alternatively, the base and the package of the chip may be configured such that the chip mates with the base in retaining the chip in the base. With the chip socket assembly, users may add, remove, or replace single chips and therefore expand the functionality of a system with the granularity of a single chip in a relatively easy manner. A chip file assembly may also be used to provide for the mechanical and electrical coupling of a plurality of edge-mountable chips to a bus of a circuit board with relative ease. Assemblies for securing horizontal chip packages are also described.

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Patent Owner(s)

Patent OwnerAddress
RAMBUS INC1050 ENTERPRISE WAY SUITE 700 SUNNYVALE CA 94089

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dillon, John B Palo Alto, CA 41 2735
Perino, Donald V Los Altos, CA 46 2840
Richardson, Wayne S Cupertino, CA 64 1199

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