Method for transferring semiconductor device layers to different substrates
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United States of America Patent
Stats
-
Jul 8, 2003
Grant Date -
May 9, 2002
app pub date -
Sep 11, 2001
filing date -
Apr 5, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for transferring layers containing semiconductor devices and/or circuits to substrates other than those on which these semiconductor devices and/or circuits have been originally fabricated. The method comprises fabricating the semiconductor devices and/or circuits, coating them with a protective layer of photoresist followed by coating with a layer of wax. A special perforated structure is then also wax coated and the waxed surface of the structure is brought into a contact with the waxed surface of photoresist. The original seed substrate is removed and the exposed surface is then coated with adhesive followed by dissolving wax through the openings in the perforated structure and attaching the layer with semiconductor devices and/or circuits to another permanent substrate. As an alternative, a disk-shaped water-soluble structure can be used instead of the perforated structure.
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