Importance

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Abstract

Disclosed are a chip size stack package and a method of fabricating the same. Two semiconductor chips are arranged such that their bond pads-forming surfaces are opposed to each other. Insulating layers are applied to the bond pads-forming surfaces of the semiconductor chips, and via-holes for exposing bond pads are formed in the insulating layers. Metal traces which are exposed at both sides of the insulating layers are formed on the via-holes, whereby the insulating layers are bonded to each other and the metal traces are also bonded to each other. One ends of metal wires are connected to the metal traces which are exposed at the insulating layers, and both sides of the semiconductor chips are molded by an encapsulate such that the other ends of the metal wires are exposed. Instead of the metal wires, pattern tapes can be used. One ends of the pattern tapes are electrically connected to the metal traces when the insulating layers are bonded to each other, and the other ends of the pattern tapes are exposed. In this case, a space between the staked semiconductor chips is also molded. In place of the encapsulate, an anisotrophic conductive adhesive can be intervened between the semiconductor chips. A heat sink can be attached to a surface of the upper semiconductor chip.

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First Claim