Thermosetting adhesive composition and adhered structure
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United States of America Patent
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Jul 8, 2003
Grant Date -
N/A
app pub date -
Sep 19, 2000
filing date -
Sep 30, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention provides thermosetting adhesives which have properties advantageous for bonding electronic parts that are capable of being cured using a low dose of radiation such as electron beam. The thermosetting adhesive of the invention comprises (a) ethylene-glycidyl (meth)acrylate copolymer; (b) rosin having a carboxyl group; and (c) (meth)acrylate having a carboxyl group.
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