Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
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United States of America Patent
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Jul 8, 2003
Grant Date -
Apr 3, 2003
app pub date -
Sep 21, 2001
filing date -
Sep 21, 2001
priority date (Note) -
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Abstract
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a partial seal (later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
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