Stacked semiconductor package formed on a substrate and method for fabrication
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United States of America Patent
Stats
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Jul 8, 2003
Grant Date -
N/A
app pub date -
Apr 12, 2002
filing date -
Apr 12, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A stacked semiconductor package formed on a substrate arranged in a serpentine configuration and a method for such fabrication are disclosed. The package is formed by at least one substrate section formed on the substrate bonded to at least one IC die by a flip-chip bonding method. The substrate is then folded onto itself such that the backside of a first IC die is adhesively bonded to the backside of a second IC die. A heat sink may optionally be utilized in-between the IC dies during the adhesive bonding process to further enhance thermal dissipation. The substrate section may be bonded to a printed circuit board by a plurality of solder balls formed on an active surface of the substrate section. The present invention can be bonded to a printed circuit board either in a horizontal position or in a vertical position for saving more real-estate on the board.
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