Method for hermetic leadless device interconnect using a submount
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United States of America Patent
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Jul 8, 2003
Grant Date -
N/A
app pub date -
Feb 28, 2000
filing date -
Feb 28, 2000
priority date (Note) -
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Abstract
In accordance with the invention, a semiconductor device having an electrical input/output contact surface is hermetically sealed and provided with connections via a submount such as a two-level ceramic substrate. The device is provided with a contact surface having a sealable peripheral contact and one or more interior contacts. The submount is provided with a peripheral sealable contact corresponding to the device peripheral contact and one or more feed-through contacts corresponding to the device interior contacts. The sealable peripheral contacts surround the interior contacts providing heremetic sealing.
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