Sensor held by base having lead
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 15, 2003
Grant Date -
Jan 17, 2002
app pub date -
Jun 29, 2001
filing date -
Jun 30, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure sensor has a sensor chip with a diaphragm formed therein and bumps formed thereon, and a stem with leads extending from a surface thereof to the sensor chip. The bumps and the leads are electrically connected by face down bonding so that a surface of the sensor chip faces the surface of the stem. In this manner, bonding wires are unnecessary. Therefore, an area for disposing the bonding wires in the stem can be cut down, so that the pressure sensor can be miniaturized.
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