Waferized power connector
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United States of America Patent
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-
Jul 15, 2003
Grant Date -
Jul 25, 2002
app pub date -
Jan 25, 2001
filing date -
Jan 25, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.
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