Nozzle arm movement for resist development

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6592932
SERIAL NO

09814131

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Abstract

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A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a nozzle adapted to apply a predetermined volume of developer material on a photoresist material layer along a linear path having a length approximately equal to the diameter of the photoresist material layer. A movement system moves the nozzle to a first position offset from a central region of the photoresist material layer for applying a first predetermined volume of developer material to the photoresist material layer while the developer material is spin coated. The movement system also moves the nozzle to a second position offset from the central region for applying a second predetermined volume of developer material to the photoresist material layer while the developer is spin coated. The first position is located on an opposite side of the central region with respect to the second position. A method of adjusting the offset position and/or volume of developer material applied at the first and second position is also provided. The method utilizes developed photoresist material layer thickness data provided by a measurement system to adjust the offset position and/or volume of the developer.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED MICRO DEVICES INC2485 AUGUSTINE DRIVE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Phan, Khoi A San Jose, CA 86 1165
Rangarajan, Bharath Santa Clara, CA 199 3111
Singh, Bhanwar Morgan Hill, CA 264 3967
Subramanian, Ramkumar San Jose, CA 287 4222
Templeton, Michael K Atherton, CA 97 1983
Yedur, Sanjay K Santa Clara, CA 34 499

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