Pressure sensor using resin adhesive between sensor element and stem
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United States of America Patent
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-
Jul 22, 2003
Grant Date -
Oct 17, 2002
app pub date -
Mar 7, 2002
filing date -
Apr 11, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In a pressure sensor made by bonding a sensor chip and a metal stem together with a resin adhesive, fluctuation of the sensor output caused by temperature changes are maximally reduced. The resin adhesive for bonding together the sensor element and the metal stem has a creep characteristic defined as CR=A.times..sigma..sup.B between its creep rate CR and stress .sigma. upon it with A and B being constants. The resin adhesive is selected to satisfy that the constant B is not greater than 3.5.
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