Ground land for singulated ball grid array
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United States of America Patent
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-
Jul 22, 2003
Grant Date -
N/A
app pub date -
Sep 11, 2000
filing date -
Sep 11, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A new ground land is provided on the BGA package that allows for increasing the test sensitivity of a wire bond tester. The ground land is interconnected with a ground ring that is provided in the immediate vicinity of the BGA device. The ground land of the invention is provided such that the location of the ground land does not unduly interfere with essential functions and locations of other components that are required for the mounting of the BGA device, most preferably in a corner of the BGA device package.
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