Via connector and method of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 29, 2003
Grant Date -
Apr 18, 2002
app pub date -
Apr 23, 2001
filing date -
Mar 20, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conductive cap layer is preferably formed over both ends of the conductive fill composition and the opposite surfaces of the insulator substrate, and can be bonded to a surface mount contact as a land or a pad.
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