Substrate processing unit and processing method
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United States of America Patent
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-
Jul 29, 2003
Grant Date -
N/A
app pub date -
Nov 15, 2000
filing date -
Nov 16, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention includes a current plate which is arranged above a substrate in a chamber. A pressure inside the chamber is reduced by exhaust means and drying processing is performed on, for example, a coating solution on the substrate. On a peripheral portion of an underneath surface of the current plate, formed is a ring-shaped protrusion corresponding to a peripheral portion of the substrate. A protruding portion of a coating solution at the peripheral portion of the substrate is made flat by air current generated when the pressure is reduced, and consequently a coating film with a uniform film thickness as a whole is formed on the substrate.
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