Process for mounting device and optical transmission apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 29, 2003
Grant Date -
May 9, 2002
app pub date -
Jun 29, 2001
filing date -
Jun 30, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An optical transmission apparatus applicable to an optical interconnection apparatus for interconnection between stacked IC chips, and a process of mounting elements for manufacturing such an apparatus are disclosed. For example, light emitting elements (2a, 2b), each having a surface emitting laser of a different wavelength, are respectively formed on trapezoidal microstructures (7a, 7b) having different sizes, and light receiving elements (3a, 3b), each having a filter for receiving light in the wavelength range of each light emitting element, are respectively formed on trapezoidal microstructures (8a, 8b) having different sizes. On substrates (4a to 4c) having concave portions (5a, 5b, 6a, 6b) which have forms identical to those of the microstructures and are formed at positions where the light emitting and receiving elements are provided, a slurry including the microstructures is made to flow, thereby each microstructure is fit into the corresponding concave portion due to gravity.
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