Systems with high density packing of micromachines
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 29, 2003
Grant Date -
Feb 6, 2003
app pub date -
Aug 3, 2001
filing date -
Aug 3, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.
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Cited Art Landscape
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