Active interposer technology for high performance CMOS packaging application
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United States of America Patent
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Jul 29, 2003
Grant Date -
N/A
app pub date -
Jan 5, 1999
filing date -
Jan 5, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An integrated circuit assembly that includes an integrated circuit which is connected to an interposer. The integrated circuit may include a logic circuit which generates an output signal. The interposer may include a driver circuit that regenerates the output signal. The interposer may also contain a clock signal that is connected to the logic circuit. Separating the driver circuit from the integrated circuit may provide an assembly which reduces the amount of noise in the logic circuit created by the driver circuit switching states. Additionally, providing the clock circuit on the interposer allows the clock to be fabricated with a more robust process than the logic circuit of the integrated circuit.
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