Modular controlled platen preparation system and method
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United States of America Patent
Stats
-
Aug 5, 2003
Grant Date -
Nov 21, 2002
app pub date -
May 17, 2002
filing date -
Apr 2, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system and method are disclosed for preparing platens to perform lapping operations. The system includes a platter that is rotatably mounted on a base and designed to receive the platen thereon. A main drive motor is provided for rotating the platter and the platen disposed thereon. A plurality of pressure arms are disposed on the base and configured to include a tool receiving portion that can be positioned in alignment with a lapping surface of the platen, and configured to softly touch a tool to a platen. A tool is attached to each tool receiving portion so that predetermined operations can be performed on the lapping surface of the platen. A monitor is provided to monitor predetermined parameters and maintain substantially constant conditions while preparing the platen.
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