Solution processing apparatus
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United States of America Patent
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Aug 5, 2003
Grant Date -
N/A
app pub date -
Oct 25, 2000
filing date -
Oct 26, 1999
priority date (Note) -
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Abstract
A developing processing apparatus for supplying a developing solution to a wafer on which a photoresist film has been formed to thereby perform developing processing includes a wafer holding portion for horizontally holding the wafer, a linear nozzle held above the wafer holding portion for supplying the developing solution onto the wafer while moving in a predetermined horizontal direction, and a resistance bar for imparting discharge resistance to the developing solution discharged from the linear nozzle. This allows all discharge ports to discharge the developing solution uniformly, especially even when discharge pressure for the developing solution to be supplied is low in development of a scan method using a linear nozzle or a slit nozzle.
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