Structure for polymeric thermistor and method of making the same
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United States of America Patent
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Aug 5, 2003
Grant Date -
Jun 12, 2003
app pub date -
Dec 7, 2001
filing date -
Dec 7, 2001
priority date (Note) -
Expired
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Abstract
A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.
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