Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor device manufactured thereby
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United States of America Patent
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-
Aug 5, 2003
Issued Date -
N/A
app pub date -
Sep 26, 2001
filing date -
Feb 3, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The semiconductor device includes a semiconductor wafer which is partitioned into chip regions by scribe line area. A device pattern is formed in the device forming region included in the chip region. A monitor pattern is formed from the same material as that of the device patterns in the chip region simultaneously with the device pattern. An interlayer insulating film is formed in the chip region so as to cover the device pattern and the monitor pattern. The monitor pattern is used to measure the thickness of the interlayer insulating film.
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