Method and system for providing a robust alignment mark at thin oxide layers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 5, 2003
Grant Date -
Jan 31, 2002
app pub date -
Feb 15, 2001
filing date -
Feb 16, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and system for providing an alignment mark for a thin layer in a semiconductor device is disclosed. The semiconductor device includes at least one alternative part having a first thickness greater than a second thickness of the thin layer. The method and system include providing the thin layer and providing the alignment mark for the thin layer in the at least one alternative part. The alignment mark has a depth that is greater than the second thickness of the thin layer. In one aspect, the method and system include providing a mask for the thin layer. The mask includes an alignment mark portion that covers the at least one alternative part and that is for providing the alignment mark. In this aspect, the method and system also include removing a portion of the at least one alternative part to provide the alignment mark in the at least one alternative part.
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