High frequency hermetic connector with ground lip
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United States of America Patent
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-
Aug 12, 2003
Grant Date -
Sep 12, 2002
app pub date -
Mar 6, 2001
filing date -
Mar 6, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention incorporates a hermetic glass bead 206 and a grounding lip 208 into an outer conductor insert 216 to form a microwave coax connector 201. The glass bead 206 forms both the hermetic seal and the support for the coax center conductor pin 214. The outer conductor insert 216 of the coax connector 201 includes the ground lip 208 to provide a short ground path for the connection to a microstrip substrate 10 provided on a carrier 12 in a housing 2. The coax connector 201 is soldered into a cavity 235 in the housing 2 to assure a short ground path between the coax connector 201 and the carrier 12. There is no need for soldering a separate glass bead into the housing 2, which at these high frequencies, is very difficult due to the small size of the glass bead.
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