Low pitch, high density connector
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United States of America Patent
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-
Aug 12, 2003
Grant Date -
Oct 31, 2002
app pub date -
Apr 26, 2001
filing date -
Apr 26, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention is directed to an improved electrical connector for electrically connecting a first component to a second component. The connector includes a plurality of electrical conductors partially embedded in a dielectric frame. The frame is formed with a first side and a second side opposed to the first side. Each conductor includes a first finger, a second finger and a midsection connecting the first finger to the second finger. The midsection of each conductor is molded in place within the frame. The first finger of each conductor extends away from the first side of the frame while the second finger of each conductor extends away from the second side of the frame. The midsections of adjacent conductors can be spaced apart within the frame at distances of less than 1.5 mm.
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