Semiconductor device
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United States of America Patent
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-
Aug 12, 2003
Grant Date -
Sep 19, 2002
app pub date -
Jul 2, 2001
filing date -
Jan 17, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Chip element formation areas and scribe line areas dividing the chip formation areas are formed on a wafer. On each scribe line area, an interconnection surrounds each chip formation area, and extends to near an edge of a wafer. With this arrangement, it is possible to provide a semiconductor device and a manufacturing method which can reduce a difference in the depositing rate of plating between the center and the periphery of the wafer.
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