Multi-feature-size electronic structures
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 12, 2003
Grant Date -
Dec 5, 2002
app pub date -
May 31, 2001
filing date -
May 31, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
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