Electric endovascular implant depolyment system
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United States of America Patent
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-
Aug 19, 2003
Grant Date -
N/A
app pub date -
May 18, 2001
filing date -
May 18, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system for releasing a graft within vasculature that incorporates graft bindings severed by current-generated heat in a resistive wire element. In one aspect, the graft is held by bindings threaded through a resistive wire loop formed between conducting wires attached to opposite ends of a high resistive wire element. When an external current source is applied to the conducting wires, heat generated in the resistive wire element causes the bindings to sever, thereby allowing the graft to be released within vasculature.
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