Plating bath and process for depositing alloy containing tin and copper
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United States of America Patent
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Aug 19, 2003
Grant Date -
N/A
app pub date -
Sep 22, 2000
filing date -
Sep 27, 1999
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Abstract
The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating bath containing tin and copper, the bath being capable of preventing deposition of copper on a tin anode by substitution, having low dependence of plated coating composition on current density, high bath stability and resistance to turbidness.
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