Antimicrobial containing solventless hot melt adhesive composition
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United States of America Patent
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Aug 19, 2003
Grant Date -
Dec 26, 2002
app pub date -
Jul 24, 2002
filing date -
Jun 12, 1996
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Abstract
An adhesive composition having dispersed therein a broad spectrum antimicrobial agent for use in medical applications, such as an adhesive for surgical drapes, wound dressings and tapes. The adhesive is composed of acrylic polymers, tackifiers and a preferred antimicrobial agent, diiodomethyl-p-tolylsulfone. The adhesive composition is essentially solventless and capable of application in a hot melt process while maintaining stability at elevated temperatures in the range of 275.degree. F. to 350.degree. F., which not only allows hot melt application, but allows for ethylene oxide sterilization under heat stress.
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