Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components
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United States of America Patent
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Aug 19, 2003
Grant Date -
Jul 25, 2002
app pub date -
Nov 7, 2001
filing date -
Nov 18, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A micro-electromechanical (MEM) process for fabrication of integrated multi-frequency communication passive components is fused into co-fired ceramics by way of 'flip chip' for fabrication of a low-cost, high-performance, and high-reliability hybrid communication passive component applicable in the frequency range of 0.9 GHz.about.100 GHz. The basic structure of the passive component is a double-layer substrate comprising a low-loss ceramic or glass bottom-layer substrate and a glass or plastic poly-molecular top-layer substrate and an optional ceramic substrate at the lowest layer. As the materials used and the processing temperature in the MEM process is compatible with the CMOS process, thus this invention is fit for serving as a post process following the CMOS process.
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