Lead frame with plated end leads
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United States of America Patent
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Aug 19, 2003
Grant Date -
N/A
app pub date -
Apr 15, 2002
filing date -
Apr 15, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.
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