Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 19, 2003
Grant Date -
Feb 14, 2002
app pub date -
Jul 11, 2001
filing date -
Aug 4, 2000
priority date (Note) -
In Force
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Abstract
A method of manufacturing a semiconductor device includes: a first step of forming a first through hole that penetrates the location of the electrode in a semiconductor element having an electrode; a second step of providing an insulating material in a region including an inside of the first through hole, in such a manner that a second through hole is provided penetrating through the insulating material; and a third step of providing a conductive member within the second through hole that penetrates through at least the insulating material in the inside of the first through hole.
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