Method for fabricating a special-purpose die using a polymerizable tape
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 26, 2003
Grant Date -
N/A
app pub date -
Jan 16, 2001
filing date -
Jan 16, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method includes adhesively mounting an adhesive lower surface of a protective layer to a top surface of a die such as an image sensor die or a micromachine die. A special-purpose area on the top surface of the die is contacted and protected by said protective layer. The protective layer includes a polymerizable material, which includes the adhesive lower surface. The method further includes rendering the adhesive lower surface to be nonadhesive. The adhesive lower surface is rendered nonadhesive by polymerizing the polymerizable material of the protective layer with ultraviolet radiation.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully