Electolytic copper foil with carrier foil and method for manufacturing the same
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United States of America Patent
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Aug 26, 2003
Grant Date -
N/A
app pub date -
Nov 7, 2001
filing date -
Nov 11, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides electrodeposited copper foil with carrier which has an organic adhesive interface layer permitting control of the lower limit of peel strength between a carrier foil and an electrodeposited copper foil and to a method for producing the electrodeposited copper foil with carrier. In the electrodeposited copper foil with carrier including a carrier foil, an adhesive interface layer formed on the carrier foil, and an electrodeposited copper foil formed on the adhesive interface layer, the carrier foil is formed of a copper foil and the adhesive interface layer contains an organic agent and metallic particles, the organic agent and the metallic particles being in an intermingled state.
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