Method of forming an integrated circuit device using dummy features and structure thereof
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United States of America Patent
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Aug 26, 2003
Grant Date -
Dec 5, 2002
app pub date -
Jun 4, 2001
filing date -
Jun 4, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for forming an integrated circuit device having dummy features and the resulting structure are disclosed. One embodiment comprises a first active feature separated from a substantially smaller second active feature by a dummy-available region void of active features. Within the dummy-available region and in close proximity to the second active feature exists a dummy feature.
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