Exposed paddle leadframe for semiconductor die packaging
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United States of America Patent
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Aug 26, 2003
Grant Date -
N/A
app pub date -
Aug 25, 2000
filing date -
Aug 25, 2000
priority date (Note) -
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status (Latency Note)
Importance
Abstract
According to one embodiment, a leadframe having at least one tab is placed inside a mold cavity. During the molding process, the ceiling of the mold cavity is pressed against the at least one tab, which in turn causes a bottom surface of the leadframe to be pressed firmly against a floor of the mold cavity. When a mold compound is injected into the mold cavity, the mold compound is prevented from reaching under the bottom surface of the leadframe. In one embodiment, the tabs are etched into one of the tie bars in the leadframe. The tabs are then mechanically formed at a nonzero angle with respect to a plane of a frame of the leadframe.
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